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Diamond multi-wire cutting equipment DA400

DA400 multi-wire cutting equipment is designed for the batch processing of super-hard and brittle materials such as sapphire, special ceramics, silicon nitride, etc. into straight pieces.The equipment is designed for a double-station design, and the cutting of super-hard and brittle materials is realized through the swing of the workpiece (reducing the cutting area).

Classification:

Semiconductor equipment

Sapphire/ceramic/other equipment

Key words: Likai CNC


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Product features:

➤The workbench adopts a double-station configuration, which can cut two plates of material at the same time.

➤Three-axis and five-axis winding methods are optional to realize the cutting of thick and thin slices.

➤The roller and retractable reel adopt high-precision and high-rigidity cone positioning to control the jitter of the wire network.

➤The operating compartment adopts an electric lifting structure and is equipped with a safety device.

➤The cutting chamber is open on three sides for easy operation and maintenance.

➤Equipped with disconnection and continuous cutting function.

 

Cutting sample:

 

Technical parameters:

 

NO. Project Content Technical parameters
1 Model Model DA400
2 Processing capacity Max processing billet size Ф125×400mm
Number of stations 2
3 Roller specifications Roller outer diameter × glue length × quantity (Ф165±10 mm )×410×5
4 Diamond thread Diamond wire diameter Ф0.12-Ф0.25
Max line storage capacity 40 km (φ0.25mm)
Max round-trip routing speed 1200 m/min
5 Workbench Workbench lifting stroke 245mm
Workbench swing ±7°
Cutting method Vertical downward feed
Cutting feed speed 0.1-99.9mm/min
6 Cutting fluid Cutting fluid Water-based or oil-based cutting fluid
Liquid storage capacity 800L
Pump flow 200L/min
7 Power/air source Power supply 380V±10%、50Hz
Power 50 Kw
Air source Using water-based cutting fluid, air pressure requirements≥0.35 MPa
8 Dimensions and weight Dimensions (L x W x H) 3150 × 1900 ×2920 mm
Weight 8000 Kg

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