Application

APPLICATION

The main products of multi-wire cutting equipment are exported to more than 30 countries and regions such as the United States, Germany, Japan, Russia, South Korea, etc., and have been recognized and praised by customers in various industries at home and abroad.

INDUSTRY APPLICATION

Special materials

Diameter 400mm-600mm quartz wafer cutting

 

◆Customer type: A quartz crystal material company

 

◆Customer demand：

The original size of the quartz round ingot that the customer requires to be cut is φ400mm-600mm*l500mm-600mm, and the target size is a wafer with a thickness of 4mm-6mm. After wire cutting, the thickness tolerance of the wafer is 0~+0.1mm, and the verticality is±0.05. There are no obvious visible contact lines on the surface, and the production capacity requirements are higher than that of saw blade cutting.

 

◆Application scenario：

Used in industrial substrate materials.

 

◆Program advantages：Special materials

Our diamond wire multi-wire cutting machine with model CA600 can just solve all the needs of this customer.

1. High-capacity, high-efficiency, multi-wire cutting, the width of the working wire network is up to 600mm, and the maximum workpiece size that can be carried is φ600mm×L600mm. Compared with the customer's traditional saw blade cutting, the production capacity is dozens of times higher.

2. High precision, after multi-wire diamond wire cutting, the surface quality of the wafer is high, and the thickness tolerance and verticality requirements meet customer needs.

3. Low loss. The diamond wire diameter used for cutting is 0.25mm. The incision is small and the loss is low, which saves material costs and increases output for customers.

 

◆Project results：

The new customer purchased 2 sets of multi-wire cutting machines CA600 in the first order.

Compared with the customer's traditional saw blade cutting, only one piece can be produced at a time. The incision is large, the material loss is large, and the time cost and material cost are high. After using the diamond wire multi-wire cutting machine, more than 90 pieces can be cut at a time, with high production capacity, high efficiency and low cost.

At the same time, the quality of the cut wafer is very high, which relatively saves the cost of subsequent grinding work.

The equipment that can solve the actual needs of customers is carefully manufactured by Likai.