Application

APPLICATION

The main products of multi-wire cutting equipment are exported to more than 30 countries and regions such as the United States, Germany, Japan, Russia, South Korea, etc., and have been recognized and praised by customers in various industries at home and abroad.

INDUSTRY APPLICATION

Semiconductor industry

4-8 inch silicon carbide wafer cutting

 

◆Customer type: A semiconductor material company

 

◆Customer demand：

The customer needs a device that can cut 4-inch, 6-inch, and 8-inch silicon carbide materials at the same time, with a target sheet thickness of 1mm, and high dimensional tolerances and surface quality requirements.

 

◆Application scenario：

Used in industrial substrate materials.

 

◆Program advantages：Semiconductor industry

Our diamond wire multi-wire cutting function with model DA600 meets the cutting needs of customers.

1. Optimized design of axis pitch, which can meet the cutting needs of silicon carbide materials of 4-8 inches；

2. Upside-down cutting, specifically for thin, hard, and crispy slices below 1mm.

3. High production capacity and high efficiency. The maximum workpiece size that the equipment can carry is 4-8 inches in diameter×L600mm.；

4. The equipment has high stability and high cutting accuracy. The equipment adopts a 3-axis design, and the spacing between the cutting rollers is more optimized to ensure a small line bow and low cutting warping.

5. High wire speed, fine wire cutting, high slicing quality, while saving materials and saving costs for customers.

 

◆Project results：

After solving the customer's needs, the customer is satisfied with the sample trial cutting, and first place an order for a piece of equipment.

Multi-wire cutting of silicon carbide flakes can not only save customers' time costs and material costs, but also solve the high-performance problems in silicon carbide applications to a greater extent.