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DA400 multi-wire cutting equipment is designed for the batch processing of super-hard and brittle materials such as sapphire, special ceramics, silicon nitride, etc. into straight pieces.The equipment is designed for a double-station design, and the cutting of super-hard and brittle materials is realized through the swing of the workpiece (reducing the cutting area).
CA600 multi-wire cutting equipment is mainly used for slicing super-hard and brittle materials such as sapphire, quartz crystals, special ceramics, silicon nitride, etc.Suitable for cutting medium and large-scale materials; the equipment has the advantages of high cutting efficiency, high slicing accuracy, stable slicing quality, and low slicing cost; it adopts a four-roller design structure and can cut products >1mm.
DA300/600 multi-wire cutting equipment is mainly used for slicing super-hard and brittle materials such as sapphire and semiconductor silicon carbide. It can process a diameter of 4-8 inches and a maximum processing length of 300mm/600mm.It has the advantages of low material loss, good processing quality, high cutting efficiency, and good stability.
DCX800/1000 single-wire cutting equipment uses a single diamond wire to cut large-size sapphire, quartz crystal, optical glass, jade and other super-hard and brittle materials.The equipment has the function of swaying the cutting line, which reduces the cutting area of the product by swaying the diamond line, and realizes the cutting of super-hard and brittle materials.
Address: No. 7, Taipei South Road, Yantai Area, Pilot Free Trade Zone of China (Shandong)
Free Trade Zone
Contact: Mr. Wang
Contact Phone: +86-18753569015
Landline: +86-535-2133055
Fax: +86-535-2133155
Mailbox: likaikeji@ytlikai.com
