Diamond multi-wire cutting equipment DA400

Djibouti Diamond multi-wire cutting equipment DA400

DA400 multi-wire cutting equipment is designed for the batch processing of super-hard and brittle materials such as sapphire, special ceramics, silicon nitride, etc. into straight pieces.The equipment is designed for a double-station design, and the cutting of super-hard and brittle materials is realized through the swing of the workpiece (reducing the cutting area).

Diamond multi-wire cutting equipment DA300/600

Djibouti Diamond multi-wire cutting equipment DA300/600

DA300/600 multi-wire cutting equipment is mainly used for slicing super-hard and brittle materials such as sapphire and semiconductor silicon carbide. It can process a diameter of 4-8 inches and a maximum processing length of 300mm/600mm.It has the advantages of low material loss, good processing quality, high cutting efficiency, and good stability.

Diamond single wire cutting equipment DCX800/1000

Djibouti Diamond single wire cutting equipment DCX800/1000

DCX800/1000 single-wire cutting equipment uses a single diamond wire to cut large-size sapphire, quartz crystal, optical glass, jade and other super-hard and brittle materials.The equipment has the function of swaying the cutting line, which reduces the cutting area of the product by swaying the diamond line, and realizes the cutting of super-hard and brittle materials.

Swing multi-wire cutting equipment CA4040

Djibouti Swing multi-wire cutting equipment CA4040

CA4040 multi-line prescribing equipment is a type of equipment designed for the batch prescribing processing needs of super hard and brittle materials such as sapphire, special ceramics, silicon nitride, etc.The equipment is designed through the swing of the workpiece (reducing the cutting area) to achieve cutting of super-hard and brittle materials; the five-roller design can achieve product cutting in the thickness range of 5mm-60mm.

Swing multi-wire cutting equipment CA400

Djibouti Swing multi-wire cutting equipment CA400

CA400 multi-wire cutting equipment is a special equipment designed for the batch processing of super-hard and brittle materials such as sapphire, quartz crystals, special ceramics, silicon nitride, etc. into straight sheets.The equipment improves the cutting speed through the swing of the workpiece (reducing the cutting area), which ensures the processing efficiency, operating stability, and process applicability, and better demonstrates the economy and practicality.

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